Effect of Cooling Conditions to Residual Warpage of LaminatedStructure Consisting of Epoxy Resin and Various Substrates

Autor: Shozo Nakamura, Akihiro Kondo, Ryosuke Miyaoka
Rok vydání: 2013
Předmět:
Zdroj: Journal of The Japan Institute of Electronics Packaging. 16:221-226
ISSN: 1884-121X
1343-9677
DOI: 10.5104/jiep.16.221
Databáze: OpenAIRE