Effect of Cooling Conditions to Residual Warpage of LaminatedStructure Consisting of Epoxy Resin and Various Substrates
Autor: | Shozo Nakamura, Akihiro Kondo, Ryosuke Miyaoka |
---|---|
Rok vydání: | 2013 |
Předmět: | |
Zdroj: | Journal of The Japan Institute of Electronics Packaging. 16:221-226 |
ISSN: | 1884-121X 1343-9677 |
DOI: | 10.5104/jiep.16.221 |
Databáze: | OpenAIRE |
Externí odkaz: |