An effective end point detector on oxide CMP by motor current

Autor:	S.-N. Lee, Bih-Tiao Lin
Rok vydání:	2003
Předmět:	Materials science Chemical-mechanical planarization Shallow trench isolation Detector Process (computing) Electronic engineering Wafer Dielectric Current (fluid) Signal
Zdroj:	10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295).
DOI:	10.1109/asmc.1999.798248
Popis:	We have proposed an end point detector (EPD) on Chemical Mechanical Polishing (CMP) by motor current. The conventional optic EPD can measure the thickness of dielectric film, but it is not easy do "in-situ" measurement. And the signal is not so clear even do "in situ" measurement. Instead of optic EPD, the EPD by motor current method can take the end point signal accuracy. We can apply the motor current method of EPD into STI, ILD, and IMD CMP process. The motor current EPD of STI, ILD, and IMD pattern wafers were demonstrated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dff57137b76b7b72174c55e32b055bff https://doi.org/10.1109/asmc.1999.798248 Zobrazit plný text záznamu