Fast diffusers in a thermal gradient (solder ball)
| Autor: | K.J. Ryan, B.H. Wood, N.A. Connelly, Xiaoli He, James R. Lloyd |
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| Rok vydání: | 2010 |
| Předmět: |
Materials science
Metallurgy Mechanical engineering Solder ball Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Temperature gradient Reliability (semiconductor) Soldering Boundary value problem Electrical and Electronic Engineering Diffuser (sewage) Safety Risk Reliability and Quality |
| Zdroj: | Microelectronics Reliability. 50:1355-1358 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2010.07.067 |
| Popis: | The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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