EMI Suppression With Distributed $LLC$ Resonant Converter for High-Voltage VR-on-Package
| Autor: | Gregory Sizikov, Kan Xu, Boris Vaisband, Xin Li, Eby G. Friedman |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
Physics
business.industry 020208 electrical & electronic engineering Electrical engineering 020206 networking & telecommunications High voltage 02 engineering and technology Voltage regulator Inductor Industrial and Manufacturing Engineering Electromagnetic interference Electronic Optical and Magnetic Materials law.invention Capacitor EMI law 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Transformer business Electrical efficiency |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:263-271 |
| ISSN: | 2156-3985 2156-3950 |
| Popis: | Higher on-chip current demand leads to lower power efficiency of the power delivery network due to distribution losses within the current path. A high-voltage power architecture and voltage regulator (VR)-on-package topology can increase system power efficiency by reducing distribution losses. Electromagnetic interference (EMI) can, however, be a significant challenge due to the high-voltage injection and close proximity to sensitive electronics. A novel transformer-based inductor, inductor, capacitor ( $LLC$ ) resonant converter with a distributed topology for point-of-load dc-to-dc conversion is presented here. The distributed topology exhibits more than $3\times $ lower EMI as compared with a single-branch $LLC$ resonant converter with the same step-down ratio. A prototype of the VR-on-package has been developed. Experimental results demonstrate good correlation with the EMI analysis. Application to systems-in-package, wireless devices, and Internet of Things is targeted due to the low EMI of this distributed converter system. |
| Databáze: | OpenAIRE |
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