Constitutive Model for Sn–Pb Solder under Fatigue Loading
| Autor: | Y. Wei, C. L. Chow, M. K. Neilsen, H. E. Fang |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
State variable
Materials science Viscoplasticity Hold time Mechanical Engineering Constitutive equation Computational Mechanics 02 engineering and technology Strain rate 021001 nanoscience & nanotechnology 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials Soldering Fatigue loading General Materials Science Composite material 0210 nano-technology Solder alloy |
| Zdroj: | International Journal of Damage Mechanics. 13:147-161 |
| ISSN: | 1530-7921 1056-7895 |
| Popis: | The paper presents a constitutive model for Sn–Pb solder which captures the response of this complex material subject to a variety of load paths including fatigue loading. Internal state variables are established to characterize grain coarsening and material degradation observed experimentally. A damagecoupled viscoplastic constitutive model is formulated to take into account the effects of temperature and loading rates on mechanical response. The influence of fatigue loading frequency or strain rate, hold time, and temperature on mechanical behavior and fatigue life for 63Sn–37Pb solder alloy is examined. The fatigue failure predictions are compared with those obtained experimentally and found to be satisfactory. |
| Databáze: | OpenAIRE |
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