Research on Bi contents addition into Sn–Cu-based lead-free solder alloy

Autor:	Hai Huang, Bin Chen, Xiaowu Hu, Xiongxin Jiang, Qinglin Li, Yinhui Che, Shuai Zu, Dingjun Liu
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Materials Science: Materials in Electronics. 33:15586-15603
ISSN:	1573-482X 0957-4522
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::df14fc3a21ff954ac1b3fc1275f20711 https://doi.org/10.1007/s10854-022-08464-7 Zobrazit plný text záznamu Full text from SpringerLink