| Autor: |
Tristan Caroff, M. Springborn, Wilhelm Maurer, M. Abo Ras, Bernhard Wunderle, Radoslava Mitova, Charles-Alix Manier, R. Mrossko, Daniel May, Hermann Oppermann, T. Xhonneux |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). |
| DOI: |
10.1109/itherm.2014.6892370 |
| Popis: |
This paper deals with the system design, technology and test of a novel concept of integrating Silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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