A Novel Conformal Thick Oxide Technology for On-Chip High-Voltage Isolation

Autor:	Guangfu Lv, Yixiao Ding, Xiangming Fang, Lisong Li, Feiming Bai, Johnny K. O. Sin, Rongxiang Wu
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 12:704-706
ISSN:	2156-3985 2156-3950
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::de948eb3553c55f99f76eee9fdf81052 https://doi.org/10.1109/tcpmt.2022.3160732 Zobrazit plný text záznamu