Subsurface Damage Distribution in Ultraprecision Machined CdS
Autor: | Don A. Lucca, C.J. Maggiore, R. L. Rhorer |
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Rok vydání: | 1996 |
Předmět: |
chemistry.chemical_classification
Materials science Precision engineering business.industry Mechanical Engineering Detector Diamond Crystal structure engineering.material Industrial and Manufacturing Engineering Optics chemistry Machining Ion channeling engineering business Inorganic compound Single crystal |
Zdroj: | CIRP Annals. 45:519-522 |
ISSN: | 0007-8506 |
DOI: | 10.1016/s0007-8506(07)63115-1 |
Popis: | The extent and distribution of the subsurface damage in ultraprecision machined CdS was examined by the use of ion channeling using glancing angle detector positioning to provide enhanced depth resolution. Single crystal (0001) oriented CdS was diamond turned over the range of depths of cut of 0.1 – 10 μm, and subsurface lattice disorder was examined for regions cut parallel to, and 30 degrees off, a preferred cleavage plane. Damage depths for the crystals machined along a preferred cleavage plane were found to be consistently larger than those machined 30 degrees off the plane. |
Databáze: | OpenAIRE |
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