| Autor: |
V. Balan, Yann Henrion, D. Bouchu, J. Jourdon, Severine Cheramy, Stephane Moreau, L. Di Cioccio, P. Lamontagne, Frank Fournel, Lucile Arnaud, A. Jouve, Sandrine Lhostis |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). |
| DOI: |
10.23919/ltb-3d.2019.8735353 |
| Popis: |
The paper reviews the robustness/reliability achievements and include previously published data related to the hybrid bonding module for W2W and D2W bonding techniques. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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