| Autor: |
Chen Tie-zhu, Yuan Sheng-jun, Zhong Jia-yong, He Sheng-zong |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 18th International Conference on Electronic Packaging Technology (ICEPT). |
| DOI: |
10.1109/icept.2017.8046607 |
| Popis: |
Merging units used in intelligent substation presented a considerable high field failure rate. To reveal the potential defects, highly accelerated life test was studied to solve the problem. The possible reasons for the poor reliability were discussed. Based on the main field failure mechanisms of the merging units, combined with the application environment and work profile, a modified highly accelerated life test for merging units was established. Through analysis to the test results, the modified test proved effective to expose the potential defects. An acceptance evaluation method based on highly accelerated life test was put forward. The method could reject more defective products into use and thus reduce more economic loss. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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