Laser slicing of a diamond at the {100} plane using an irradiation sequence that restricts crack propagation along the {111} plane

Autor:	Kosuke Sakamoto, Daijiro Tokunaga, Sho Itoh, Hirofumi Hidai, Souta Matsusaka, Takashige Omatsu, Koji Koyama, Seong-Woo Kim, Noboru Morita
Rok vydání:	2023
Předmět:	Mechanical Engineering Materials Chemistry General Chemistry Electrical and Electronic Engineering Electronic Optical and Magnetic Materials
Zdroj:	Diamond and Related Materials. 136:110045
ISSN:	0925-9635
DOI:	10.1016/j.diamond.2023.110045
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dd9729b9f9eb30b4d6ab329deedb8203 https://doi.org/10.1016/j.diamond.2023.110045 Zobrazit plný text záznamu Full Text from ScienceDirect