Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection

Autor:	Lei Jin, An-Ni Zheng, Mei Wang, Jia-Qiang Yang, Zhao-Yun Wang, Fang-Zu Yang, De-Yin Wu, Dongping Zhan
Rok vydání:	2023
Předmět:	Colloid and Surface Chemistry
Zdroj:	Colloids and Surfaces A: Physicochemical and Engineering Aspects. 671:131706
ISSN:	0927-7757
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dd4a19de4fd26b77f58ed32268f550c9 https://doi.org/10.1016/j.colsurfa.2023.131706 Zobrazit plný text záznamu Full Text from ScienceDirect