Warpage and Reliability Simulation of Super-Size Embedded Silicon Fan-out (eSiFO) Package with size 40mm×40mm

Autor:	Hao Wei, Dongzhi Fu, Shuying Ma, Zhiyi Xiao, Jiao Wang
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
DOI:	10.1109/icept56209.2022.9873460
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dd1d37f9ce3873710fbe92a5e46521c6 https://doi.org/10.1109/icept56209.2022.9873460 Zobrazit plný text záznamu