Local stress measurement methods for packaging purposes- A comparison

Autor:	Dietmar Vogel, Bernd Michel, Astrid Gollhardt
Rok vydání:	2010
Předmět:	Stress relief Micrometer scale Materials science Resolution (electron density) Electronic packaging Mechanical engineering Nanotechnology Stress measurement Image resolution
Zdroj:	3rd Electronics System Integration Technology Conference ESTC.
DOI:	10.1109/estc.2010.5643016
Popis:	The paper gives a brief overview on some advanced stress measurement methods, which permit local access to semiconductor or packaging structures with a micrometer scale spatial resolution. Focusing is made on local stress relief, Raman spectroscopy and EBSD based techniques. The methods are compared with respect to their resolution limits, feasibility to be applied to different materials and their specific limitations.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dd15ef0d9dce6b3d214f0927112cde4d https://doi.org/10.1109/estc.2010.5643016 Zobrazit plný text záznamu