| Autor: |
Sung-Kwa Kim, Seok Cheon Lee, Dong-Ik Shin, Young-Su Jin, Dong Ho Shin, KiUn Lee, Jung-Eun Noh, Ho-Seop Jeong, Seok Ho Song, Hye-Ran Oh |
| Rok vydání: |
2006 |
| Předmět: |
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| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 230 μm sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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