The Impact of Environment Humidity on WS Paste Characteristics

Autor:	Zhang Rui Fen, Lim Chze Min Jason, Yam Lip Huei, Balasubramanian Senthil Kumar, Sarangapani Murali, Zhang Han Wen, SS Kang Sungsig, Chan Li-San
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013151
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::dcbfe379c48b310dfa90316199719333 https://doi.org/10.1109/eptc56328.2022.10013151 Zobrazit plný text záznamu