Effects of gallium, phosphorus and nickel addition in lead-free solders: A review
| Autor: | Narayana Aditya, K. Palanikumar, Pushkaraj D. Sonawane, V.K. Bupesh Raja, V. Rohit, Eriki Ananda Kumar |
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| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science business.industry Melting temperature Metallurgy chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Nickel Lead (geology) chemistry Soldering 0103 physical sciences Microelectronics Gallium 0210 nano-technology business Ductility |
| Zdroj: | Materials Today: Proceedings. 46:3578-3581 |
| ISSN: | 2214-7853 |
| Popis: | Ever since the start of the electronic age, soldering has been an important interconnecting method in microelectronic packaging. Since the 1960 s, development of information technology (IT)-infrastructure has witnessed rapid advancement owing to development of novel electronic equipment. This, in turn, has led to growth and progression of industries and improved human lifestyle. Present-day electronic gadgets are highly sophisticated and comprise several components. Sn–Pb based solder alloys have always delivered excellent results, offering several amazing benefits, namely, easy handling, low melting temperature, good working condition, ductility, and exceptional wetting on Cu and its alloys. Owing to its lethal and harmful effects on health and the environment, the US Congress introduced the legislation on the limited use of Pb in 1990. Consequently, alternatives to lead free solders are being developed for last three decades. This literature review discusses the effect of Gallium, Phosphorus and Nickel addition on solder alloy microstructure and mechanical properties. |
| Databáze: | OpenAIRE |
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