Immersion Cooling for High-Density Packaging
| Autor: | K. Niwa, K. Yokouchi, N. Kamehara |
|---|---|
| Rok vydání: | 1987 |
| Předmět: |
Temperature control
Materials science Nuclear engineering General Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials Coolant Boiling point Volume (thermodynamics) Boiling Heat transfer Electronic engineering Integrated circuit packaging Electrical and Electronic Engineering Nucleate boiling |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 10:643-646 |
| ISSN: | 0148-6411 |
| DOI: | 10.1109/tchmt.1987.1134778 |
| Popis: | New cooling techniques using direct immersion cooling for high-density packaging are discussed, focussing on a) the treatment of bubbles produced by nucleate boiling and b) the control of coolant composition to prevent "temperature overshoot" occurring at the boiling point as thermal hysteresis. Maintaining subcool boiling (the initial stage of nucleate boiling) until maximum power application is a useful cooling technique in high-density packaging of computers because this technique produces fewer troubles than saturated boiling. The module model, which incorporated subcool boiling, showed a high cooling capability of 10 W/cm2at the chips, and 1.0 kW for the 900-cm3module volume. Controlling coolant composition produces azeotropic boiling which, in turn, prevents temperature overshoot. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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