Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process
| Autor: | Chao-Shun Yang, Li-Chih Fang, Ji-Cheng Lin, Hsi-Tseng Chou, Ding-Bing Lin, Chi-Liang Pan, Zhao-He Lin, Chun-Te Lin, Kuan-Hsun Wu, Chieh-Wei Chou, Pin-Zhong Shen |
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| Rok vydání: | 2020 |
| Předmět: |
Physics
business.industry 020208 electrical & electronic engineering 020206 networking & telecommunications 02 engineering and technology Radio spectrum System in package Microstrip antenna Optics User equipment Extremely high frequency 0202 electrical engineering electronic engineering information engineering Active antenna Reflection coefficient business Beam (structure) |
| Zdroj: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc32862.2020.00104 |
| Popis: | In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 × 4 and 6 × 6 microstrip antenna elements on the stacked substrates of conventional system-in-package process to realize the desired gains for 5G applications. Within a 19 × 19 mm2 area, we are able to achieve -10 dB reflection coefficient bands of 24.25-29.5 and 37-43.5 GHz by simulations for the two most popular 5G frequency bands, where the simulated gains are 13.7 and 15.22 dBi, respectively. The beam scan range is up to ±40o. On the other hand, the CPE AiP is designed on a 33 × 33 mm2 area, where the maximum gains are 18.83 and 21.25dBi at 28 and 39 GHz, respectively. |
| Databáze: | OpenAIRE |
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