Analytical Study and Experimental Verification of the Refraction Angle as a Function of Frequency Due to Surface Waves Incident Onto a Tensor Impedance Sheet
| Autor: | Gholamreza Dadashzadeh, Mojtaba Mighani |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry Isotropy Scalar (mathematics) 020206 networking & telecommunications 02 engineering and technology Cladding (fiber optics) Printed circuit board Optics Surface wave 0202 electrical engineering electronic engineering information engineering Boundary value problem Electrical and Electronic Engineering Anisotropy business Electrical impedance |
| Zdroj: | IEEE Transactions on Antennas and Propagation. 67:4642-4649 |
| ISSN: | 1558-2221 0018-926X |
| Popis: | In this paper, using the theory of tensor impedance boundary conditions, a surface structure with new applications is presented. The proposed structure includes a tensor impedance sheet (TIS) alongside a scalar impedance sheet (SIS) which is designed by arrays of cells containing subwavelength patterned metallic cladding over a grounded dielectric substrate. In this structure, a method is presented to study the electromagnetic surface wave (SW) passing through a boundary between an isotropic and anisotropic impedance surface. If an SW with a specified frequency is excited on a SIS and orthogonally propagates onto the boundary of a TIS, due to the refraction of the SW, the propagation direction of the SW on the TIS will change. Therefore, the SW will enter the TIS with a specified angle, which is called the refraction angle. In this paper, the frequency variations of the refraction angle are studied in the proposed structure. Finally using the presented method, a sample structure is designed and simulated in 15.1–15.75 GHz frequency. In addition, the structure is fabricated and the results of the proposed model are verified with simulation and measurement. Moreover, an equation with an analytical solution is presented in order to model tensor impedance boundary conditions using printed circuits. This can make TIS design quick and accurate. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|