Modeling and simulation of workpiece surface flatness in magnetorheological plane finishing processes
Autor: | Jianyong Li, Yueming Liu, Liu Zhanbin, Meng Nie |
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Rok vydání: | 2020 |
Předmět: |
0209 industrial biotechnology
White light interferometry Materials science business.industry Mechanical Engineering Flatness (systems theory) Mechanical engineering Polishing 02 engineering and technology Industrial and Manufacturing Engineering Computer Science Applications Magnetic field Modeling and simulation 020901 industrial engineering & automation Semiconductor Amplitude Control and Systems Engineering Magnetorheological fluid business Software |
Zdroj: | The International Journal of Advanced Manufacturing Technology. 111:2637-2651 |
ISSN: | 1433-3015 0268-3768 |
Popis: | Multi-pole arrangements in magnetorheological plane finishing technology have been investigated in this study. A method of combining the material removal mechanism of micro-points using the empirical Preston equation is proposed to establish a prediction model for surface flatness, and the new Semiconductor Equipment and Materials International (SEMI) standard has been used to evaluate workpiece surface flatness. Based on the model, the effects of process parameters (polishing time, speed ratio, translational amplitude, polishing gap, etc.) on the flatness of workpieces with different shapes are predicted through simulation, and the effects of multi-pole arrangements are explored. The results of the analysis indicate that with changes in process parameters, the extent of change in surface flatness differs based on the shape of the workpiece. After polishing, concave workpieces show the highest levels of surface flatness. From simulations of magnetic pole arrangements, it is also found that magnetic field generators with different magnetic pole arrangements can be used for workpieces with different shapes to improve their surface flatness. Experiments with a workpiece with its shape measured using a white light interferometer showed that the surface flatness improved from being 33.561 μm initially to 21.822 μm after polishing, thereby demonstrating the effectiveness of the proposed method. |
Databáze: | OpenAIRE |
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