Autor: |
Bao Hoang, Todd Schneider, Gordon Wu, K. H. Wright, Jason A. Vaughn, Frankie Wong |
Rok vydání: |
2016 |
Předmět: |
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Zdroj: |
2016 IEEE 43rd Photovoltaic Specialists Conference (PVSC). |
DOI: |
10.1109/pvsc.2016.7750123 |
Popis: |
Tests were performed on a 56-cell Advanced Triple Junction solar array coupon whose purpose was to determine margin available for bypass diodes integrated with new, large multi-junction solar cells that are manufactured from a 4-inch wafer. The tests were performed under high vacuum with coupon back side thermal conditions of both cold and ambient. The bypass diodes were subjected to a sequence of increasing discrete current steps from 0 A to 2.0 A in steps of 0.25 A. At each current step, a temperature measurement was obtained via remote viewing by an infrared camera. This paper discusses the experimental methodology, experiment results, and the thermal model. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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