Low-cost TSH (through-silicon hole) interposers for 3D IC integration
Autor: | John H. Lau, Chau-Jie Zhan, Chun-Hsien Chien, Ming-Ji Dai, Ra-Min Tain, Ming-Jer Kao, Yu-Mei Cheng, Pai-Cheng Chang, W. L. Tsai, Sheng-Tsai Wu, Yu-Lin Chao, Ren-Shin Cheng, Heng-Chieh Chien, Li-Ling Liao, Zhi-Cheng Hsiao, Yuan-Chang Lee, Ching-Kuan Lee, Yu-Wei Huang, Wei-Chung Lo, Huan-Chun Fu |
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Rok vydání: | 2014 |
Předmět: |
Materials science
Fabrication Silicon business.industry Emphasis (telecommunications) chemistry.chemical_element Three-dimensional integrated circuit Hardware_PERFORMANCEANDRELIABILITY Temperature cycling Shock (mechanics) chemistry Chip-scale package Hardware_INTEGRATEDCIRCUITS Electronic engineering Interposer Optoelectronics business |
Zdroj: | 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). |
DOI: | 10.1109/ectc.2014.6897301 |
Popis: | In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure. |
Databáze: | OpenAIRE |
Externí odkaz: |
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