Effect of Printed Circuit Board Design Parameters on Solder Joint Reliability for Memory Packages
| Autor: | Koustav Sinha, Christopher Glancey, Wren Chen, Pluck Yang, Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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