New silicon micromachining techniques for microsystems
| Autor: | P.T.J. Gennissen, Patrick J. French, Pasqualina M. Sarro |
|---|---|
| Rok vydání: | 1997 |
| Předmět: |
Bulk micromachining
Plasma etching Materials science Fabrication Silicon Metals and Alloys chemistry.chemical_element Nanotechnology Substrate (electronics) Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Surface micromachining chemistry visual_art Microsystem visual_art.visual_art_medium Tile Electrical and Electronic Engineering Instrumentation |
| Zdroj: | Sensors and Actuators A: Physical. 62:652-662 |
| ISSN: | 0924-4247 |
| DOI: | 10.1016/s0924-4247(97)01502-1 |
| Popis: | Traditionally there have been two types of micromachining, bulk and surface micromachining. More recently a modification to tile bulkmicromachining technique, where the micromachining is performed in the top few microns of the substrate, has been receiving attention. Many of these techniques may also be called epi-micromachining, since the mechanical devices are often formed in the epilayer, They have many of the advantages of both bulk and surface micromachining without the disadvantages. Structures fabricated using these new technologies may have lateral dimensions similar to those of surface micromachining but with a considerably increased vertical dimension. In this paper the development of these silicon micmmachining techniques is discussed along with the compatibility issues. |
| Databáze: | OpenAIRE |
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