| Autor: |
Alan M. Bond, Milka T. Neshkova, Vesselin Petrov, V.D. Nikolova |
| Rok vydání: |
2005 |
| Předmět: |
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| Zdroj: |
Electrochimica Acta. 50:5606-5615 |
| ISSN: |
0013-4686 |
| Popis: |
A detailed electrochemical study of the ternary Cu + Ag + Se system on Pt substrate using the techniques of cyclic voltammetry (CV), hydrodynamic voltammetry at Pt-rotated disc electrode (RDE), anodic stripping has identified optimum conditions for the electrodeposition of ternary CuAgSe thin semiconductor films used as active membranes in developing Cu(II)-ion-selective sensors. A combined coulometry-quartz crystal microbalance (EQCM) protocol has been developed which allows real-time phase composition analysis of the target ternary CuAgSe and admixture with either Cu 2 Se or Ag 2 Se binary selenides. The EQCM data have provided valuable information concerning the mechanistic details of the CuAgSe-electrodeposition. The molar ratio of Cu:Se in the electrolytic bath is shown to be of crucial importance for depositing device quality films. Different mechanisms dominate when this ratio is increased from 1:5 to 1:1, from one-step diffusion-controlled electrochemical process (Cu:Se = 1:5) to a mixed electrochemical and chemical pathway for Ag + assimilation (Cu:Se = 1:1). |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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