Annealing behavior of phosphorus in native oxide films on heavily phosphorus doped silicon
Autor: | Yoshitomo Kamiura, Y.B. Yu, Wen Biao Ying, Makio Iida, Yusuke Mizokawa, Kazunori Kawamoto |
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Rok vydání: | 1996 |
Předmět: |
Dopant
Silicon Chemistry Annealing (metallurgy) Chemical structure Oxide Analytical chemistry General Physics and Astronomy chemistry.chemical_element Surfaces and Interfaces General Chemistry Condensed Matter Physics Surfaces Coatings and Films chemistry.chemical_compound Phosphorus doped X-ray photoelectron spectroscopy Redistribution (chemistry) |
Zdroj: | Applied Surface Science. :556-560 |
ISSN: | 0169-4332 |
DOI: | 10.1016/0169-4332(96)00338-8 |
Popis: | Phosphorus redistribution and its chemical structure in the native oxide/Si as well as thermal oxides (∼ 30 nm)/Si were investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS). The Si substrates were both heavily P-doped Si(100) and poly-Si, together with nondoped poly-Si. The in-depth profiles of P obtained by both XPS and SIMS showed that the dopant-P redistributed in the thin native oxide film (NOF) even at room temperature, and the amount of P increased drastically upon annealing. The amount of redistributed P was much larger for Si(100) than for poly-Si. The dominant chemical structure of P was not P 2 O 5 but elemental-P and/or Si-P. Clear pileup of P at theNOF/Si interface could not be observed, since the thickness of NOF is very thin and probably P diffused into throughout the NOF. In the case of thermal oxides, both SIMS and XPS profiles exhibited a big pileup-P at the oxide/Si interface. The amount of pileup-P was about two times larger for the Si(100) than for the poly-Si, and it increased with annealing temperature. In the oxide films, the 31 P in SIMS as well as P 0 and P 2 O 5 features in XPS were also detected, although the intensities were very weak compared to those at the interface. |
Databáze: | OpenAIRE |
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