Electromigration Behavior of Screen-Printing Silver Nanoparticles Interconnects
| Autor: | Wan-Hsuan Lin, Fan-Yi Ouyang |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry 0211 other engineering and technologies General Engineering 02 engineering and technology 021001 nanoscience & nanotechnology Electromigration Silver nanoparticle Cathode law.invention Grain growth law Electrical resistivity and conductivity Screen printing Optoelectronics General Materials Science 0210 nano-technology business Joule heating Current density 021102 mining & metallurgy |
| Zdroj: | JOM. 71:3084-3093 |
| ISSN: | 1543-1851 1047-4838 |
| DOI: | 10.1007/s11837-019-03627-0 |
| Popis: | Printing technology is one of the promising patterning techniques in flexible electronic devices due to its low cost and large-area patternability. In this study, the electromigration (EM) behavior of printed interconnects composed of silver nanoparticles was investigated under a current density of 1.5 × 105 A/cm2 at ambient temperature of 150°C. During the EM test, the morphologies of silver nanoparticles changed as a result of the decrease in the cross-section of the interconnect and the increase in Joule heating generated under high current density. Once the temperature at the cathode of printed interconnects was higher than 350°C, the aggregation and grain growth of Ag nanoparticles began to occur. The Ag particles formed an island-like morphology and the connection among the Ag nanoparticles was completely broken, leading to the loss of their electrical conductivity and open-circuit failures of the printed interconnects at the cathode side. |
| Databáze: | OpenAIRE |
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