| Autor: |
Surya Bhattacharya, David Ho Soon Wee, Eva Wai Leong Ching, Lim Teck Guan, Jong Ming Ching, Loh Woon Leng |
| Rok vydání: |
2021 |
| Předmět: |
|
| Zdroj: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc32696.2021.00050 |
| Popis: |
A FOWLP and a Si-Interposer integration platform for Electronic IC (EIC) and Photonic IC (PIC) are described here. These two platforms are capable to support high-speed integration and scalable design of the next generation Optical Engine. The integration of the PIC on the FOWLP is achieved by a simple novel solution. An additional section of the Si substrate is designed at the end of the PIC to protect the optical I/Os during the FOWLP embedding process. For the Through Si-Interposer, besides providing the EIC and PIC, it include the passive alignment feature for the fibre to the PIC assembly. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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