| Popis: |
By employing bond-wires connecting the top cover and the PCB ground plane, the shielding effectiveness could be dramatically improved. The packages with a thicker and larger number of bond-wires exhibit better performance. At least 4 bond-wires should be inserted to prevent resonance within the third harmonic frequency for the present structure. For the same number of bond-wires, the equally spaced bond-wires exhibit the best shielding effectiveness and the highest resonance frequency. Thus, careful selection of the location, spacing and number of bond-wires can significantly improve the EMI shielding effectiveness of the RF SiP module. |
