A novel thermally conductive transparent die attach adhesive for high performance LEDs
| Autor: | Kai Zhang, Jie Li, Chuiming Wan, Zhaoming Zeng, Lisa Liu, Matthew Ming Fai Yuen, Deng Shaojia, Xin Shihan, He Xiaowu, Chengqiang Cui, Yunbo He, Yu Zhang, Cheng Sheng Ku, Guowei David Xiao |
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| Rok vydání: | 2019 |
| Předmět: |
Materials science
Mechanical Engineering Thermal resistance Surface modified 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences 0104 chemical sciences law.invention Viscosity Thermal conductivity Mechanics of Materials law Thermal General Materials Science Adhesive Composite material 0210 nano-technology Electrical conductor Light-emitting diode |
| Zdroj: | Materials Letters. 235:216-219 |
| ISSN: | 0167-577X |
| DOI: | 10.1016/j.matlet.2018.09.170 |
| Popis: | High thermal conductivity, low viscosity and high transparency are desired properties of die attach adhesives (DAA) for LEDs to achieve high thermal and optical performance as well as good reliability. However, it is challenging for DAAs with thermally conductive fillers to keep a low viscosity and high transparency. In this paper, a novel DAA with designed hyper-branched epoxy-silicone and surface modified fused silica was formulated to improve the thermal conductivity without sacrificing high transparency and low viscosity. Compared with a widely used commercial DAA, 165% thermal conductivity improvement and 83% viscosity reduction are achieved, resulting in 26% thermal resistance reduction, 7% light extraction enhancement, and 14% less lumen degradation in accelerate aging test for mid-power LED packages. |
| Databáze: | OpenAIRE |
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