Impact of Young Modulus of Epoxy Glue to Copper Wire Bonding
| Autor: | El Chung, KG Tan, CM Wai, Dandong Ge |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Wire bonding
Materials science business.industry chemistry.chemical_element Young's modulus Hardware_PERFORMANCEANDRELIABILITY Epoxy Chip Copper symbols.namesake Semiconductor chemistry visual_art Hardware_INTEGRATEDCIRCUITS symbols visual_art.visual_art_medium Ultrasonic sensor Composite material business Curing (chemistry) |
| Zdroj: | 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT). |
| DOI: | 10.1109/iemt.2018.8511763 |
| Popis: | Epoxy glue still remains as one of the main medium being used for die attach process in current semiconductor technologies. Different types of epoxy glue have different young modulus due to their own properties from different epoxy glue manufacturer. The current chip size is getting smaller and smaller due to cost saving projects from FE wafer fab. If the chip size is getting smaller but still using the same epoxy glue, then the low young modulus of the epoxy glue will become a big challenge especially for copper wire bonding process due to high Z die displacement during wire bonding process. This is due to the ultrasonic energy will not be transmitted effectively to the copper wire and bond pad surface without rigid support to the chip. In this paper, different die attached chip sizes are being studied with different young modulus epoxy glue using simulation tool to measure the die z displacement and also actual copper wire bonding process to assess the wire bonding performance. |
| Databáze: | OpenAIRE |
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