Healing processes in submicron Al interconnects after electromigration failure

Autor:	J. A. Prybyla, Alan W. Hunt, S. P. Riege
Rok vydání:	1997
Předmět:	In situ transmission electron microscopy Materials science Physics and Astronomy (miscellaneous) Transmission electron microscopy Metallurgy Composite material Joule heating Microstructure human activities Electromigration
Zdroj:	Applied Physics Letters. 70:2541-2543
ISSN:	1077-3118 0003-6951
DOI:	10.1063/1.118914
Popis:	Investigations of the healing of electromigration-induced open-circuit failed submicron Al(0.5%Cu) interconnects were performed using in situ transmission electron microscopy (TEM). The samples consisted of 4000 A thick Al (0.5%Cu) patterned over a TEM-transparent window into five runners in parallel, with linewidths 0.2, 0.3, 0.5, 0.8, and 1.0 μm. A novel sample design minimized any Joule heating in the runners. Our approach has allowed us to observe voids form, grow, migrate, fail a runner, and heal all with respect to the detailed local microstructure of the runners. In this letter, we focus on our time-resolved observations of the mechanisms of healing.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d981a4467a61842c052261b76c0722f6 https://doi.org/10.1063/1.118914 Zobrazit plný text záznamu