Influence of Temperature and Current Stressing on Cu‐Sn Intermetallic Compound Growth Characteristics of Lead‐Free Microbump
| Autor: | Zhiwei Fu, Qinru Wei, Xiaotong Guo, Xing Fu, Jian Wang, Chao Yang, Huaixin Guo, Jia‐Yue Yang |
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| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | Advanced Theory and Simulations. 6 |
| ISSN: | 2513-0390 |
| DOI: | 10.1002/adts.202200881 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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