| Popis: |
Techniques for forming dielectric layers for fabricating semiconductor components are reviewed, including (1) low‐pressure techniques: evaporation, sputtering, plasma deposition, and low‐pressure CVD, (2) techniques operating at one atmosphere total pressure: thermal oxidation, chemical vapor deposition, anodization, electrophoresis, spin on, spray on, silk screening, and (3) a number of miscellaneous techniques: roller coating, offset printing, centrifugation–sedimentation, and transfer. The advantages and limitations of the methods are presented and typical applications are given. Novel applications of the technology to other‐than‐silicon semiconductor devices are outlined, and future trends in the technology are indicated. |
