High-speed optoelectronic VLSI switching chip with <4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS
| Autor: | L.A. D'Asaro, B. Tseng, James A. Walker, Keith W. Goossen, D.D. Bacon, D. Dahringer, R.E. Leibenguth, Anthony L. Lentine, John Cunningham, G. Livescu, D.B. Buchholz, R.L. Morrison, S.P. Hui, W. Y. Jan, R. A. Novotny, J.M. Kuo, L.M.F. Chirovsky, D. Kossives |
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| Rok vydání: | 1996 |
| Předmět: |
Very-large-scale integration
Materials science business.industry Photonic integrated circuit Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Chip Optical switch Atomic and Molecular Physics and Optics Optical modulator CMOS Hardware_INTEGRATEDCIRCUITS Optoelectronics Electrical and Electronic Engineering business Flip chip Hardware_LOGICDESIGN Diode |
| Zdroj: | IEEE Journal of Selected Topics in Quantum Electronics. 2:77-84 |
| ISSN: | 1077-260X |
| DOI: | 10.1109/2944.541876 |
| Popis: | We present the first high-speed optoelectronic very large scale integrated circuit (VLSI) switching chip using III-V optical modulators and detectors flip-chip bonded to silicon CMOS. The circuit, which consists of an array of 16/spl times/1 switching nodes, has 4096 optical detectors and 256 optical modulators and over 140K transistors. All but two of the 4352 multiple-quantum-well diodes generate photocurrent in response to light. Switching nodes have been tested at data rates above 400 Mb/s per channel, the delay variation across the chip is less than /spl plusmn/400 ps, and crosstalk from neighboring nodes is more than 45 dB below the desired signal. This circuit demonstrates the ability of this hybrid device technology to provide large numbers of high-speed optical I/O with complex electrical circuitry. |
| Databáze: | OpenAIRE |
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