An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems
| Autor: | Lesley Polka, Swan Johanna M, Ravi Mahajan, Gaurang N. Choksi |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
System in package
Computer architecture business.industry Computer science InformationSystems_INFORMATIONSYSTEMSAPPLICATIONS Embedded system ComputerSystemsOrganization_COMPUTER-COMMUNICATIONNETWORKS Industrial research ComputerApplications_COMPUTERSINOTHERSYSTEMS Data_CODINGANDINFORMATIONTHEORY Architecture Communications system business |
| Zdroj: | Advances in Electronic Packaging, Parts A, B, and C. |
| DOI: | 10.1115/ipack2005-73320 |
| Popis: | Research and development on System in Package (SiP) technologies is prevalent now both in industry and academia. This paper provides an overview of SiP from a CPU and communications systems perspective. Some of the items that will be covered include what defines a “system” for SiP, what value a SiP architecture brings, the types of SiP packaging architectures and technologies, and the challenges involved with developing SiP solutions.Copyright © 2005 by ASME |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|