Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates

Autor:	Slavka Tzanova, Nikolay Kurtev
Rok vydání:	2019
Předmět:	Cfd simulation Materials science chemistry.chemical_element Heat sink law.invention Power (physics) LED lamp chemistry Aluminium law visual_art visual_art.visual_art_medium Ceramic Composite material Thermal analysis Light-emitting diode
Zdroj:	2019 IEEE XXVIII International Scientific Conference Electronics (ET).
DOI:	10.1109/et.2019.8878320
Popis:	In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d66bbd5d353fcb3eb3d09ab317819fa6 https://doi.org/10.1109/et.2019.8878320 Zobrazit plný text záznamu