The Impact of Multi-Core Architectures on Design of Chip-Level Interconnect Networks

Autor:	James D. Meindl, D.C. Sekar
Rok vydání:	2007
Předmět:	Multi-core processor Interconnection Materials science business.industry Hardware_INTEGRATEDCIRCUITS Electronic engineering Single-core Hardware_PERFORMANCEANDRELIABILITY Integrated circuit design business Chip Computer hardware Dual core
Zdroj:	2007 IEEE International Interconnect Technology Conferencee.
DOI:	10.1109/iitc.2007.382371
Popis:	This paper studies the impact of multi-core architectures on design of chip-level interconnect networks. A dual core 3 GHz processor is found to require 23% fewer metal levels than a single core 6 GHz processor while a quad core 1.5 GHz processor needs 38% fewer interconnect levels than the single core 6 GHz processor. This is because lower frequency chips can use smaller pitch wires and pack the wiring into a fewer number of metal levels.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d637d36103da6c22d18e472dfc1fd741 https://doi.org/10.1109/iitc.2007.382371 Zobrazit plný text záznamu