Applications of parallel optical interconnects

Autor:	W.K. Honea, J.S. Helton, J.R. Bortolini, G.J. Grimes, W.R. Holland, P.J. Anthony, J.P.C. Markush, C.J. Sherman, S.R. Peck, G.L. Sonnier, D.J. Muehler, C.C. Faudskar, J.V. Gates, Yiu-Man Wong, J.S. Nyquist, E.G. Priest
Rok vydání:	2002
Předmět:	Silicon photonics Materials science business.industry Optical transistor Optical cross-connect Electrical engineering Optoelectronics Integrated circuit packaging Optical performance monitoring business Optical switch Waveguide (optics) Vertical-cavity surface-emitting laser
Zdroj:	Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society.
Popis:	The first phase of OETC (OETC-1) produced a parallel, 32-channel, high density (140 mm pitch), 500 Mb/s NRZ, point to point, optical data link. This link has a 32 channel VCSEL array operating at 850 nm and a 32 channel MCM receiver array. The key packaging technologies include the silicon optical bench technology and a multichip module technology. The transmitter and receiver parts were directly connected (no pigtails) using MACII-32 connectors.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d5cd21629a4ec3e4216cef89271f7ece https://doi.org/10.1109/leos.1996.571520 Zobrazit plný text záznamu