Design aspects of microwave components with LTCC technique
| Autor: | S. Leppävuori, T. Kangasvieri, J. Vähäkangas, Heli Jantunen |
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| Rok vydání: | 2003 |
| Předmět: |
Interconnection
Materials science business.industry Circuit design Automotive industry Ceramic materials Reliability (semiconductor) visual_art Electronic component Hardware_INTEGRATEDCIRCUITS Materials Chemistry Ceramics and Composites visual_art.visual_art_medium Electronic engineering Ceramic business Microwave Electronic circuit |
| Zdroj: | Journal of the European Ceramic Society. 23:2541-2548 |
| ISSN: | 0955-2219 |
| DOI: | 10.1016/s0955-2219(03)00155-9 |
| Popis: | Low temperature co-fired ceramic (LTCC) technology, widely used in the automotive industry, is now being employed in microwave applications. Several commercial materials with low dielectric losses at microwave frequencies and adequate thermomechanical properties have been introduced. Computer-aided design of three-dimensional circuits has also become available. These advances together with high-quality manufacturing technology have placed LTCCs at the forefront in the development of miniature microwave devices. The paper outlines LTCC technology placing emphasis on those essentials of the materials and processing technologies about which the microwave circuit designer needs to be aware. The discussion is illustrated by examples.The crucial issue of component reliability is also addressed. Although the integration of passive components into the structure improves reliability, the joints between the LTCC module and PCB remain as significant ‘weak link’. Therefore, thermomechanical and structural design is a key to reliable LTCC assemblies.Finally, some future trends the LTCC technology for microwave applications are outlined. |
| Databáze: | OpenAIRE |
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