| Autor: | Jusheng Ma, Jiman Zhu, Daobin Mu, Guo Liquan, Yudong Liu |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Materials science
Anodizing Metallurgy Electronic packaging chemistry.chemical_element Substrate (printing) Condensed Matter Physics Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Anode law.invention chemistry Aluminium law Ball grid array Forensic engineering Electrical and Electronic Engineering Photolithography Electroplating |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 13:597-600 |
| ISSN: | 0957-4522 |
| DOI: | 10.1023/a:1020104332105 |
| Popis: | An anodizing technique was employed to prepare insulated metal substrates (IMS) for BGA package in this study. The insulating anodic films of aluminum that were chosen as the substrate were studied with different anodizing processes. A multiple-anodizing process improved the characteristics of IMS, including insulating and thermal performances. BGA packages were achieved on the IMS through electroless plating, electroplating, and photolithography methods. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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