Transient IR imaging of light and flexible microelectronic devices
| Autor: | Henri Seppänen, Heimo Saarikko, Ivan Kassamakov, Pasi Vihinen, Markku Oinonen, Zoran Radivojevic |
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| Rok vydání: | 2006 |
| Předmět: |
Ir thermography
Engineering Interconnection business.industry Quality assessment 02 engineering and technology Converters 021001 nanoscience & nanotechnology Condensed Matter Physics Transient temperature 01 natural sciences Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials 010309 optics 0103 physical sciences Electronic engineering Microelectronics Optoelectronics Transient (oscillation) Electrical and Electronic Engineering 0210 nano-technology Safety Risk Reliability and Quality business Heat flow |
| Zdroj: | Microelectronics Reliability. 46:116-123 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2005.01.013 |
| Popis: | An advanced method for the quality assessment of microelectronic assemblies has been developed by combining IR thermography and several techniques for stimulation by transient temperature fields. The method exploits singularities in materials and interconnections by the observation of perturbations in transient heat flow phenomena. For very light microelectronic systems like chip-on-flex assemblies a method was developed taking advantage of short stimulations by photoflash. Such a method provided possibilities for detecting defects on the level of a single interconnection with a pitch of 80 μm. In addition, a programmable array of thermo-electric converters, prepared for the testing of a large variety of microelectronic assemblies, was also used to perform transient IR imaging for chip-on-flex assemblies. |
| Databáze: | OpenAIRE |
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