Failures of Ag Wire Bonding ICs in Real-world Applications
| Autor: | Xuanlong Chen, Xiaping Xie, Min Wang, Yongjia Ruan, Tianhan Liu, Lin Shi |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| DOI: | 10.1109/ipfa55383.2022.9915707 |
| Databáze: | OpenAIRE |
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