Epoxy resin bearing diacylhydrazine moiety as a degradable adhesive for traceless oxidative removal
| Autor: | Nobuhiro Kihara, Takahiro Oguri, Akie Kawahara |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
endocrine system
Materials science Polymers and Plastics Bisphenol 02 engineering and technology 010402 general chemistry Hydrazide 01 natural sciences chemistry.chemical_compound Polymer chemistry Materials Chemistry Organic chemistry Moiety Solubility Alkyl Curing (chemistry) chemistry.chemical_classification Organic Chemistry Epoxy 021001 nanoscience & nanotechnology 0104 chemical sciences chemistry visual_art visual_art.visual_art_medium Adhesive 0210 nano-technology |
| Zdroj: | Polymer. 99:83-89 |
| ISSN: | 0032-3861 |
| DOI: | 10.1016/j.polymer.2016.06.066 |
| Popis: | Bisphenols functionalized with diacylhydrazine moieties and ester groups were prepared from 5-hydroxyisophthalic acid by esterification and partial hydrazination, followed by oxidative coupling of the obtained hydrazide. Ester groups with long alkyl chains or polyether increased the solubility of bisphenols in the epoxy resin. The epoxy resin was cured by heating with bisphenols in the presence of a catalytic amount of imidazole, with more rapid curing observed for more soluble bisphenols. The cured resin, with Td5 ≈ 300 °C, decomposed rapidly when exposed to sodium hypochlorite solution. The above resin could be used as a strong and tough adhesive for metal and glass, whereas it can be easily removed by treatment with sodium hypochlorite solution without any trace. The observed dismantling rate positively correlated with bisphenol solubility. |
| Databáze: | OpenAIRE |
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