Electrochemical Corrosion Behavior of Sn–1.0Ag–0.5Cu and Sn–3.8Ag–0.7cu Lead Free Solder Alloys During Storage and Transportation Under Chloride Working Condition

Autor:	Raj Kumar Kaushik, J. D. Sharma, Uma Batra
Rok vydání:	2021
Předmět:	Materials science Metallurgy Tin oxide Chloride Electrochemical corrosion Electronic Optical and Magnetic Materials Corrosion Working condition Dielectric spectroscopy Soldering medicine Miniaturization Electrical and Electronic Engineering medicine.drug
Zdroj:	Transactions on Electrical and Electronic Materials. 23:371-381
ISSN:	2092-7592 1229-7607
Popis:	The Continuous miniaturization of electronics set stringent requirements of corrosion resistance as imposed by high-density packaging. The present work elucidates electrochemical corrosion behaviours of two conventional lead-free solder alloys, i.e., Low-Ag (Sn–1.0Ag–0.5Cu, SAC105) and High-Ag (Sn–3.8Ag–0.7Cu, SAC387) solder alloys. The Electrochemical Impedance Spectroscopy and Potentiodynamic polarization performed in naturally aerated 0.5 M NaCl solution for 1 h, 24 h, 168 h, 336 h, 504 h and 672 h suggest that SAC387 solder offers higher corrosion resistance than SAC105 solder. The SAC105 solder is sparsely cover with fine-fibrous corrosion product, while platelet-like and fibrous mass entirely covers SAC387 solder. Microstructural and elemental characterization of corrosion product revealed the presence of tin oxide, Cu and Ag containing products as several pit, cracks and pore-like structures.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d4ad72d10bd0168b710bfc9563f21b6b https://doi.org/10.1007/s42341-021-00354-9 Zobrazit plný text záznamu Full text from SpringerLink