| Popis: |
this paper proposes another technology for forced cooling of the heat sink installed on the CPU. Due to overheating of electronic equipment, its efficiency is decreasing and it has many effects on the biosphere. The purpose of this article is to explore techniques to reduce the heat generated by electronic devices. This article presents the limitations of existing methods and suggests ways to improve the performance of electronic devices. Use commercially available computational fluid dynamics software [3] to perform numerical analysis on radiator efficiency, the influence of turbulence mode, the influence of radiation heat transfer [3], and different radiator geometries. For all electronic cards and packaging, conjugate heat transfer [3] is simulated. Use a network independent model with good convergence and good planning. |
