Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process

Autor:	A. Elsherbini, K. Jun, S. Liff, T. Talukdar, J. Bielefeld, W. Li, R. Vreeland, H. Niazi, B. Rawlings, T. Ajayi, N. Tsunoda, T. Hoff, C. Woods, G. Pasdast, S. Tiagaraj, E. Kabir, Y. Shi, W. Brezinski, R. Jordan, J. Ng, X. Brun, B. Krisnatreya, P. Liu, B. Zhang, Z. Qian, M. Goel, J. Swan, G. Yin, C. Pelto, J. Torres, P. Fischer
Rok vydání:	2022
Zdroj:	2022 International Electron Devices Meeting (IEDM).
DOI:	10.1109/iedm45625.2022.10019499
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d43d17f6c3f29f04ec0213b69a36bdc5 https://doi.org/10.1109/iedm45625.2022.10019499 Zobrazit plný text záznamu