A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties

Autor:	Minoru Ueshima, Daewoong Suh, Chi-Won Hwang, Jun Sugimoto
Rok vydání:	2008
Předmět:	Materials science Creep Mechanics of Materials Mechanical Engineering Soldering Metallurgy Intermetallic General Materials Science Wetting Condensed Matter Physics Ductility Homologous temperature
Zdroj:	Materials Letters. 62:2017-2020
ISSN:	0167-577X
DOI:	10.1016/j.matlet.2007.11.006
Popis:	A novel low-temperature solder which consists entirely of two phases of intermetallic compounds is reported. The new solder can be reflowed below 125 °C and yet maintains high-temperature mechanical properties at homologous temperatures exceeding 0.9. Specifically, the new solder exhibits creep resistance and high-temperature retention capability exceeding those of conventional low-temperature solders, and its strength even exceeds that of Sn–4%Ag–0.5%Cu (SAC405) at the same homologous temperatures. This intermetallic solder also exhibits room-temperature ductility comparable to conventional solders. Drastic enhancement of wettability is achieved with addition of active metals.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d4238114b23133c5a7ac1ca3c4693303 https://doi.org/10.1016/j.matlet.2007.11.006 Zobrazit plný text záznamu Full Text from ScienceDirect